Dielectric films and materials therefor

ABSTRACT

A material for dielectric films is a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1):  
                 
 
wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y 1 , Y 2 , Y 3  and Y 4  are the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group; an aromatic polyamine represented by following Formula (2):  
                 
 
wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R 1  and R 2  are each a substituent bound to Ring Z, are the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group; and a solvent other than ketones and aldehydes, in which the adamantanepolycarboxylic acid and aromatic polyamine are dissolved in the solvent.

This application is a Divisional application under 35 U.S.C. §120 ofco-pending application Ser. No. 10/807,326, filed on Mar. 24, 2004, andapplication Ser. No. 10/807,326 claims priority under 35 U.S.C. §119(a)on Patent Application No(s). JP2003-086164 and JP2003-325518 filed inJAPAN on Mar. 26, 2003 and Sep. 18, 2003, respectively, the entirecontents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a material for the formation of apolybenzazole (imidazole, oxazole or thiazole) film having high heatresistance and a low dielectric constant, as well as a polymer and adielectric film using the material. More specifically, it relates to amaterial for the formation of a dielectric film which is useful as asemiconductor part, as well as a polymer and a dielectric film using thematerial.

2. Description of the Related Art

Polybenzazoles having an adamantane skeleton are useful as highlyheat-resistant resins (Journal of Polymer Science, Part A-1 (1970),8(12), p. 3665-3666). In particular, highly crosslinked polybenzazolesusing a trifunctional or tetrafunctional adamantane derivative involve amultitude of molecular-scale voids, have a low relative dielectricconstant and satisfactory mechanical strength and heat resistance andare thereby very useful as materials for interlayer dielectrics(Japanese Unexamined Patent Application Publication (JP-A) No.2001-332543). These highly crosslinked polybenzazoles can be prepared,for example, by heating a material in the presence of a condensing agentsuch as a polyphosphoric acid. However, the resulting highly crosslinkedresin is hardly soluble in solvent and cannot be significantly appliedto a substrate by coating to form a thin film.

A thin film of a wholly aromatic chain polybenzazole is formed by amethod, in which an aldehyde derivative as a material monomer is spreadover an aqueous solution of an amine as another material monomer to forma film by polymerization on a gas-liquid interface; the film islaminated on a substrate by a horizontal attachment method and issubjected to a thermal treatment in the air to form a thin film of apolybenzazole (Japanese Unexamined Patent Application Publication (JP-A)No. 62-183881). However, the method is not suitable for industrialproduction, since it takes quite a long time to form the thin film. Inaddition, the precursor polyimine is subjected to an oxidative thermaltreatment in a final process, and the resulting polybenzazole film maybe possibly oxidized, thus a lower dielectric constant as a dielectricfilm is not expected.

SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to provide a materialfor dielectric films, which can easily yield a film containing a highlycrosslinked polybenzazole and having high heat resistance and a lowdielectric constant.

Another object of the present invention is to provide a polymer formedfrom specific compounds, and a dielectric film which contains thepolymer and is useful as, for example, semiconductor parts.

After intensive investigations to achieve the above objects, the presentinventors have found that a highly functional highly crosslinkedpolybenzazole film can be formed by dissolving anadamantanepolycarboxylic acid and an aromatic polyamine in a specificsolvent. The present invention has been accomplished based on thesefindings.

Specifically, the present invention provides a material for dielectricfilms, which is a polymerizable composition containing anadamantanepolycarboxylic acid represented by following Formula (1):

wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group;and Y¹, Y², Y³ and Y⁴ may be the same as or different from one anotherand are each a single bond or a bivalent aromatic cyclic group, anaromatic polyamine represented by following Formula (2):

wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R¹ andR² are each a substituent bound to Ring Z, may be the same as ordifferent from each other and are each an amino group, amono-substituted amino group, a hydroxyl group or a mercapto group; anda solvent other than ketones and aldehydes, wherein theadamantanepolycarboxylic acid and the aromatic polyamine are dissolvedin the solvent.

The present invention also provides a polymer which is a polymerizedproduct of a polymerizable composition containing anadamantanepolycarboxylic acid represented by following Formula (1):

wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group;and Y¹, Y², Y³ and Y⁴ may be the same as or different from one anotherand are each a single bond or a bivalent aromatic cyclic group; anaromatic polyamine represented by following Formula (2):

wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R¹ andR² are each a substituent bound to Ring Z, may be the same as ordifferent from each other and are each an amino group, amono-substituted amino group, a hydroxyl group or a mercapto group; anda solvent other than ketones and aldehydes, wherein theadamantanepolycarboxylic acid and the aromatic polyamine are dissolvedin the solvent.

The present invention further provides a polymer which is a polymerizedproduct of an adamantanepolycarboxylic acid represented by followingFormula (1a):

wherein X^(a) is a hydrogen atom or a hydrocarbon group; and Y¹, Y², Y³and Y⁴ may be the same as or different from each other and are each asingle bond or a bivalent aromatic cyclic group, and an aromaticpolyamine represented by following Formula (2):

wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R¹ andR² are each a substituent bound to Ring Z, may be the same as ordifferent from each other and are each an amino group, amono-substituted amino group, a hydroxyl group or a mercapto group.

The present invention further provides a dielectric film containing oneof the polymers.

The present invention also provides a dielectric film containing apolymer formed from an adamantanepolycarboxylic acid represented byfollowing Formula (1):

wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group;Y¹, Y², Y³ and Y⁴ may be the same as or different from one another andare each a single bond or a bivalent aromatic cyclic group; and anaromatic polyamine represented by following Formula (2):

wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R¹ andR² are each a substituent bound to Ring Z, may be the same as ordifferent from each other and are each an amino group, amono-substituted amino group, a hydroxyl group or a mercapto group, inwhich the dielectric film has a 5% weight loss temperature of 500° C. orhigher.

The material for dielectric films of the present invention uses asolvent other than ketones and aldehydes and can easily yield a highlycrosslinked polymer, whose polymerization reaction is not adverselyaffected by a Schiff base formed with a monomer component aromaticpolyamine. The resulting dielectric film formed by using the materialcan have high heat resistance and a low dielectric constant.

Further objects, features and advantages of the present invention willbecome apparent from the following description of the preferredembodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an infrared absorption spectrum of a polymer film preparedin Example 1; and

FIG. 2 shows an infrared absorption spectrum of a polymer film preparedin Comparative Example 1.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The material for dielectric films of the present invention is apolymerizable composition as a solution of an adamantanepolycarboxylicacid represented by Formula (1) and an aromatic polyamine represented byFormula (2) in a solvent other than ketones and aldehydes.

Adamantanepolycarboxylic Acid

The adamantanepolycarboxylic acid represented by Formula (1) serves as ahighly crosslinkable monomer component and constitutes the material fordielectric films of the present invention. In Formula (1), thehydrocarbon group in X includes, for example, aliphatic hydrocarbongroups, alicyclic hydrocarbon groups, aromatic hydrocarbon groups, andgroups comprising two or more of these groups combined with each other.Examples of the aliphatic hydrocarbon groups are methyl, ethyl, propyl,isopropyl, butyl, isobutyl, s-butyl, t-butyl, pentyl, hexyl, decyl,dodecyl, and other straight- or branched-chain alkyl groups each havingabout 1 to about 20 carbon atoms, of which those having 1 to 10 carbonatoms are preferred, and those having 1 to 6 carbon atoms are morepreferred; vinyl, allyl, 1-butenyl, 3-methyl-4-pentenyl, and otherstraight- or branched-chain alkenyl groups each having about 2 to about20 carbon atoms, of which those having 2 to 10 carbon atoms arepreferred, and those having 2 to 5 carbon atoms are more preferred;ethynyl, propynyl, 1-butynyl, 2-butynyl, and other straight- orbranched-chain alkynyl groups each having about 2 to about 20 carbonatoms, of which those having 2 to 10 carbon atoms are preferred, andthose having 2 to 5 carbon atoms are more preferred.

Examples of the alicyclic hydrocarbon groups are monocyclic alicyclichydrocarbon groups, such as cyclopropyl, cyclobutyl, cyclopentyl,cyclohexyl, cyclooctyl, and other cycloalkyl groups each having about 3to about 20 members, of which those having 3 to 15 members arepreferred, and those having 3 to 12 members are more preferred;cyclopropenyl, cyclobutenyl, cyclopentenyl, cyclohexenyl, and othercycloalkenyl groups each having about 3 to about 20 members, of whichthose having 3 to 15 members are preferred, and those having 3 to 10members are more preferred. Examples of the alicyclic hydrocarbon groupsalso include bridged hydrocarbon groups each having, for example, abicyclic, tricyclic or tetracyclic hydrocarbon ring such as adamantanering, perhydroindene ring, decalin ring, perhydrofluorene ring,perhydroanthracene ring, perhydrophenanthrene ring,tricyclo[5.2.1.0^(2,6)] decane ring, perhydroacenaphthene ring,perhydrophenalene ring, norbornane ring, and norbornene ring. Examplesof the aromatic hydrocarbon groups are phenyl, naphthyl, and otheraromatic hydrocarbon groups each having about 6 to about 20 carbonatoms, of which those having 6 to 14 carbon atoms are preferred.

Examples of hydrocarbon groups comprising an aliphatic hydrocarbon groupand an alicyclic hydrocarbon group combined with each other includecyclopentylmethyl, cyclohexylmethyl, 2-cyclohexylethyl, otherC₃-C₂₀cycloalkyl-C₁-C₄alkyl groups, and other cycloalkyl-alkyl groups.Examples of hydrocarbon groups comprising an aliphatic hydrocarbon groupand an aromatic hydrocarbon group combined with each other includeC₇-C₁₈ aralkyl groups, and other aralkyl groups; and phenyl or naphthylgroup substituted with about one to about four C₁-C₄ alkyl groups, andother alkyl-substituted aryl groups.

These aliphatic hydrocarbon groups, alicyclic hydrocarbon groups,aromatic hydrocarbon groups, and groups comprising these groups combinedwith each other may each have one or more substituents. Suchsubstituents are not specifically limited, as long as they do notadversely affect the reaction and examples thereof include halogen atomssuch as fluorine, chlorine, bromine and iodine atoms; substituted oxygroups including alkoxy groups such as methoxy and ethoxy groups,cycloalkyloxy groups, aryloxy groups, acyloxy groups, and silyloxygroups; substituted oxycarbonyl groups such as alkyloxycarbonyl groupsand aryloxycarbonyl groups; acyl groups such as acetyl group and otheraliphatic acyl groups, acetoacetyl group, alicyclic acyl groups, andaromatic acyl groups; aliphatic hydrocarbon groups; alicyclichydrocarbon groups; aromatic hydrocarbon groups; and heterocyclicgroups.

The substituent X is preferably a hydrogen atom, a carboxyl group, aC₁-C₆ alkyl group or a C₆-C₁₄ aromatic hydrocarbon group. Among them, acarboxyl group is typically preferred, since the resulting adamantanecompound has four functional groups and can be crosslinked more highly.

Examples of the aromatic ring corresponding to the bivalent aromaticcyclic group in Y¹, Y², Y³ and Y⁴ include monocyclic or polycyclicaromatic hydrocarbon rings and aromatic heterocyclic rings. An exampleof the monocyclic aromatic hydrocarbon rings is benzene ring. Examplesof the polycyclic hydrocarbon rings are naphthalene ring, anthracenering, phenanthrene ring, phenalene ring, and other rings having a fusedring structure in which two or more aromatic rings commonly possess twoor more atoms; and biphenyl ring, biphenylene ring, fluorene ring, andother rings having a structure in which two or more aromatic rings arebound via a linkage group such as a single bond, or an alicyclic ring.Examples of the aromatic heterocyclic rings are monocyclic or polycyclicaromatic heterocyclic rings containing one or more hetero atoms such asoxygen atom, sulfur atom and nitrogen atom. Specific examples of thearomatic heterocyclic rings are furan ring, thiophene ring, pyridinering, picoline ring, and other monocycles; quinoline ring, isoquinolinering, acridine ring, phenazine ring, and other polycycles. Thesearomatic rings may each have one or more substituents. Examples of suchsubstituents are those exemplified as the subsistent which thehydrocarbon group in X may have.

Typical examples of the adamantanepolycarboxylic acids are

-   1,3,5-adamantanetricarboxylic acid,-   7-methyl-1,3,5-adamantanetricarboxylic acid,-   7-phenyl-1,3,5-adamantanetricarboxylic acid,-   1,3,5-tris(4-carboxyphenyl)adamantane,-   1,3,5-tris(4-carboxyphenyl)-7-methyladamantane,-   1,3,5-tris(4-carboxyphenyl)-7-phenyladamantane,-   1,3,5,7-adamantanetetracarboxylic acid, and-   1,3,5,7-tetrakis(4-carboxyphenyl)adamantane.

Each of these adamantanepolycarboxylic acids can be used alone or incombination.

The adamantanepolycarboxylic acids represented by Formula (1) can beprepared according to a known or conventional procedure not specificallylimited. For example, an adamantanepolycarboxylic acid, in which Y¹, Y²,Y³ and Y⁴ in Formula (1) are aromatic rings, can be prepared by thefollowing process. An aromatic compound corresponding to Y¹, Y², Y³ andY⁴ is reacted with 1,3,5,7-tetrabromoadamantane by catalysis of AlCl₃ toform 1,3,5,7-tetra-aromatic-ring-adamantane; for example, thepara-position of the 1,3,5,7-tetra-aromatic-ring adamantane is iodizedwith iodine; and the resulting 1,3,5,7-tetrakis (iodized aromaticring-substituted) adamantane is carboxylated in the presence of carbondioxide by catalysis of, for example, sec-butyllithium, to yield thetarget compound.

The adamantanepolycarboxylic acids represented by Formula (1a)correspond to adamantanepolycarboxylic acids of Formula (1), wherein Xis a hydrogen atom or a hydrocarbon group.

Aromatic Polyamine

The aromatic polyamine represented by Formula (2) serves as a monomercomponent constituting the material for dielectric films of the presentinvention, in addition to the adamantanepolycarboxylic acid. Thearomatic ring in Ring Z in Formula (2) can be any of those exemplifiedas the aromatic ring corresponding to the bivalent aromatic cyclic groupin Y¹, Y², Y³ and Y⁴. The aromatic ring may have one or moresubstituents. Such substituents are not specifically limited, as long asthey do not adversely affect the reaction. Typical examples of thesubstituents are halogen atoms such as bromine, chlorine, and fluorineatoms; aliphatic hydrocarbon groups such as methyl, ethyl, propyl,butyl, t-butyl, and other C₁-C₄ alkyl groups; alicyclic hydrocarbongroups such as cyclohexyl group, and other cycloalkyl groups havingabout 3 to about 15 members; aromatic hydrocarbon groups such as phenyl,benzyl, naphthyl, toluyl group, and other aromatic hydrocarbon groupshaving about 6 to about 20 carbon atoms, of which those having 6 to 14carbon atoms are preferred; hydroxyl group which may be protected by aprotecting group; amino group which may be protected by a protectinggroup; and mercapto group which may be protected by a protecting group.Conventional protecting groups in the field of organic synthesis can beused herein.

Examples of the mono-substituted amino group in R¹ and R² are groupscorresponding to an amino group, except with a substituent replacing oneof the hydrogen atoms of the amino group. Examples of the substituentare aliphatic hydrocarbon groups such as methyl, ethyl, propyl, butyl,t-butyl, and other alkyl groups having about 1 to 10 carbon atoms, ofwhich those having about 1 to about 6 carbon atoms are preferred,alkenyl groups having about 2 to about 10 carbon atoms, of which thosehaving about 2 to about 5 carbon atoms are preferred, alkynyl groupshaving about 2 to about 10 carbon atoms, of which those having about 2to about 5 carbon atoms are preferred; alicyclic hydrocarbon groups suchas cyclohexyl group, and other cycloalkyl groups having about 3 to about15 members, of which those having about 3 to about 12 carbon atoms arepreferred; and aromatic hydrocarbon groups such as phenyl, benzyl,naphthyl, toluyl, and other aromatic hydrocarbon groups having about 6to about 14 carbon atoms. The groups R¹ and R²in Ring Z in Formula (2)are preferably positioned at the alpha-position or the beta-positionwith respect to a carbon atom having —NH₂ (amino group) in Ring Z,respectively.

For example, a 5-membered azole ring is formed as a result of thereaction between an aromatic polyamine having R¹ (or R²) at thealpha-position of the carbon atom having —NH₂ (amino group) in Ring Z,and an adamantanepolycarboxylic acid. More specifically, an imidazolering is formed when R¹ is an amino group or mono-substituted aminogroup; an oxazole ring is formed when R¹ is a hydroxyl group; and athiazole ring is formed when R¹ is a mercapto group.

A 6-membered nitrogen-containing ring is formed as a result of thereaction between an aromatic polyamine having R¹ (or R²) at thebeta-position of the carbon atom having —NH₂ (amino group) in Ring Z,and an adamantanepolycarboxylic acid. More specifically, a hydrodiazinering is formed when R¹ is an amino group or a mono-substituted aminogroup; an oxazine ring is formed when R¹ is a hydroxyl group; and athiazine ring is formed when R¹ is a mercapto group.

The positions of the two amino groups in Ring Z in Formula (2) are notspecifically limited, as long as these groups can be combined withcarboxyl groups in the adamantanepolycarboxylic acid to form, forexample, a 5- or 6-membered ring together with adjacent carbon atoms,and are preferably such positions that the two amino groups are notadjacent to each other.

Typical examples of the aromatic polyamine are

-   1,2,4,5-tetraaminobenzene, 1,4-diamino-2,5-dihydroxybenzene,-   1,5-diamino-2,4-dihydroxybenzene,-   1,4-diamino-2,5-dimercaptobenzene,-   1,5-diamino-2,4-dimercaptobenzene,-   1,4-diamino-2,5-bis(methylamino)benzene,-   1,5-diamino-2,4-bis(methylamino)benzene,-   1,4-diamino-2,5-bis(phenylamino)benzene,-   1,5-diamino-2,4-bis(phenylamino)benzene, and other    polyaminobenzenes; 2,3,6,7-tetraaminonaphthalene,-   1,4,5,8-tetraaminonaphthalene,-   2,6-diamino-3,7-dihydroxynaphthalene,-   2,7-diamino-3,6-dihydroxynaphthalene,-   1,4-diamino-5,8-dihydroxynaphthalene,-   1,5-diamino-4,8-dihydroxynaphthalene,-   2,6-diamino-3,7-dimercaptonaphthalene,-   2,7-diamino-3,6-dimercaptonaphthalene,-   1,4-diamino-5,8-dimercaptonaphthalene,-   1,5-diamino-4,8-dimercaptonaphthalene,-   2,6-diamino-3,7-bis(methylamino)naphthalene,-   2,7-diamino-3,6-bis(methylamino)naphthalene,-   1,4-diamino-5,8-bis(methylamino)naphthalene,-   1,5-diamino-4,8-bis(methylamino)naphthalene,-   2,6-diamino-3,7-bis(phenylamino)naphthalene,-   2,7-diamino-3,6-bis(phenylamino)naphthalene,-   1,4-diamino-5,8-bis(phenylamino)naphthalene,-   1,5-diamino-4,8-bis(phenylamino)naphthalene, and other    polyaminonaphthalenes; 3,3′-diaminobenzidine,-   3,3′-dihydroxybenzidine, 3,4′-diamino-3′,4-dihydroxybiphenyl,-   3,3′-dimercaptobenzidine,-   3,4′-diamino-3′,4-dimercaptobiphenyl,-   3,3′-bis(methylamino)benzidine,-   3,4′-diamino-3′,4-bis(methylamino)biphenyl,-   3,3′-bis(phenylamino)benzidine,-   3,4′-diamino-3′,4-bis(phenylamino)biphenyl, and other    polyaminobiphenyls.

Typical examples of the aromatic polyamine also include

-   2,3,6,7-tetraaminoanthracene,-   2,6-diamino-3,7-dihydroxyanthracene,-   2,7-diamino-3,6-dihydroxyanthracene,-   2,6-diamino-3,7-dimercaptoanthracene,-   2,7-diamino-3,6-dimercaptoanthracene,-   2,6-diamino-3,7-bis(methylamino)anthracene,-   2,7-diamino-3,6-bis(methylamino)anthracene,-   2,6-diamino-3,7-bis(phenylamino)anthracene,-   2,7-diamino-3,6-bis(phenylamino)anthracene, and other    polyaminoanthracenes; 2,3,7,8-tetraamino-1H-phenalene,-   3,8-diamino-2,7-dihydroxy-1H-phenalene,-   2,8-diamino-3,7-dihydroxy-1H-phenalene,-   3,8-diamino-2,7-dimercapto-1H-phenalene,-   2,8-diamino-3,7-dimercapto-1H-phenalene,-   3,8-diamino-2,7-bis(methylamino)-1H-phenalene,-   2,8-diamino-3,7-bis(methylamino)-1H-phenalene,-   3,8-diamino-2,7-bis(phenylamino)-1H-phenalene,-   2,8-diamino-3,7-bis(phenylamino)-1H-phenalene, and other    polyaminophenalenes; 4,5,9,10-tetraaminopyrene,-   4,9-diamino-5,10-dihydroxypyrene,-   4,10-diamino-5,9-dihydroxypyrene,-   4,9-diamino-5,10-dimercaptopyrene,-   4,10-diamino-5,9-dimercaptopyrene,-   4,9-diamino-5,10-bis(methylamino)pyrene,-   4,10-diamino-5,9-bis(methylamino)pyrene,-   4,9-diamino-5,10-bis(phenylamino)pyrene,-   4,10-diamino-5,9-bis(phenylamino)pyrene, and other polyaminopyrenes.

Each of these aromatic polyamines can be used alone or in combination.The aromatic polyamines represented by Formula (2) can be preparedaccording to a known or conventional procedure.

Other Components

The material for dielectric films (hereinafter may be referred to as“material composition”) of the present invention may further compriseother components in addition to the above components. For example, thematerial composition may further comprise a catalyst for acceleratingthe polymerization reaction. Typical examples of the catalyst aresulfuric acid, methanesulfonic acid, p-toluenesulfonic acid, and otheracid catalysts. The amount of the catalyst is, for example, from about0% by mole to about 10% by mole, and preferably from about 0% by mole toabout 5% by mole relative to the total amount of the monomer components(the adamantanepolycarboxylic acid and the aromatic polyamine). Thematerial composition may comprise a thickening agent (bodying agent) forincreasing the viscosity of the resulting composition as a solution.Typical examples of the thickening agent are ethylene glycol, diethyleneglycol, triethylene glycol, polyethylene glycol, and other alkyleneglycols and polyalkylene glycols. The amount of the thickening agent is,for example, from about 0% by weight to about 20% by weight, andpreferably from about 0% by weight to about 10% by weight based on thetotal amount of the material composition (coating liquid). The materialcomposition may also comprise a monocarboxylic acid for adjusting themolecular weight of the resulting polymer, and/or a dicarboxylic acidfor adjusting the degree of crosslinking of the polymer. Typicalexamples of the monocarboxylic acid are adamantanecarboxylic acid andbenzoic acid. Typical examples of the dicarboxylic acid areadamantanedicarboxylic acid and terephthalic acid. The amount of themonocarboxylic acid is, for example, from about 0% by mole to about 10%by mole, and preferably from about 0% by mole to about 5% by molerelative to the adamantanepolycarboxylic acid. The amount of thedicarboxylic acid is, for example, from about 0% by mole to about 100%by mole, and preferably from about 0% by mole to about 50% by molerelative to the adamantanepolycarboxylic acid.

The material composition may contain an adhesion promoter for increasingthe adhesion of the resulting dielectric film to a substrate. Typicalexamples of the adhesion promoter is trimethoxyvinylsilane,hexamethyldisilazane, γ-aminopropyltriethoxysilane, and aluminummonoethylacetoacetate diisopropylate. The amount of the adhesionpromoter is, for example, from about 0% by weight to about 10% byweight, and preferably from about 0% by weight to about 5% by weightrelative to the total amount of the monomer components.

Solvent

The solvent for use in the present invention is not specificallylimited, as long as it is a solvent other than ketones and aldehydes.Examples of the solvent are aliphatic hydrocarbons such as hexane,heptane and octane; alicyclic hydrocarbons such as cyclohexane andmethylcyclohexane; aromatic hydrocarbons such as benzene, toluene,xylenes, ethylbenzene and mesitylene; halogenated hydrocarbons such asdichloromethane, dichloroethane, chloroform and carbon tetrachloride;alcohols such as methanol, ethanol, propanol, butanol and ethyleneglycol; ethers such as dioxane, tetrahydrofuran, diethyl ether andpropylene glycol monomethyl ether (PGME); esters such as formic esters,acetic esters, propionic esters, benzoic esters, γ-butyrolactone andpropylene glycol monomethyl ether acetate (PGMEA); carboxylic acids suchas formic acid, acetic acid, propionic acid and butyric acid; aproticpolar solvents such as acetonitrile, propionitrile, benzonitrile andother nitriles, formamide, dimethylformamide, acetamide,dimethylacetamide, N-methylpyrrolidone and other amides, anddimethylsulfoxide and other sulfoxides. Each of these solvents can beused alone or in combination.

One of the important features of the present invention is that a solventother than ketones and aldehydes is used as a solvent for dissolving themonomer components. If a ketone or an aldehyde is used as a solvent, thesolvent itself reacts with the monomer component aromatic polyamine toform a Schiff base which adversely affects the polymerization reactionto thereby fail to give a high degree of crosslinking. In contrast, asolvent other than ketones and aldehydes neither reacts with thearomatic polyamine nor adversely affects the polymerization reaction andcan form a highly crosslinked polymer (high molecular weight crosslinkedproduct) to thereby yield a polymer film having high heat resistance anda low dielectric constant.

Material for Dielectric Films

The polymerizable composition as the material for dielectric films(material composition) can be prepared according to any procedure, aslong as the adamantanepolycarboxylic acid and the aromatic polyamine(monomer components) can be completely dissolved in the solvent. Forexample, it can be prepared by stirring or leaving stand a mixturecomprising the monomer components, the solvent, and other components.The ratio of the adamantanepolycarboxylic acid to the aromatic polyaminecan be set freely depending on the solubility in the solvent, as long asthe functions of the resulting dielectric film are not adverselyaffected. The molar ratio of the adamantanepolycarboxylic acid to thearomatic polyamine is preferably from about 10:90 to about 60:40, andmore preferably from about 20:80 to about 50:50. The total amount of theadamantanepolycarboxylic acid and the aromatic polyamine (total monomeramount) can be arbitrarily set depending on the solubility in thesolvent and is, for example, from about 1% by weight to about 60% byweight, and preferably from about 5% by weight to about 50% by weightrelative to the amount of the solvent.

The components may be dissolved in the solvent in any atmosphere such asair atmosphere, as long as the aromatic polyamine is not oxidized, butpreferably in an atmosphere of inert gas such as nitrogen or argon gas.The temperature for dissolution is not specifically limited and, wherenecessary, the composition maybe heated depending on the solubility ofthe monomer components and the boiling point of the solvent. Thetemperature for dissolution is, for example, from about 0° C. to 200°C., and preferably from about 10° C. to about 150° C.

To form a dielectric film exhibiting high heat resistance due to itshigh degree of crosslinking, a possible material is a polycondensedproduct (polybenzazole) of an adamantanepolycarboxylic acid and anaromatic polyamine. However, such a polycondensed polybenzazole has ahigh degree of crosslinking, thereby has a low solubility in solvent andcannot be significantly used as a material for forming a thin dielectricfilm by coating. In contrast, the material composition containing themonomer components completely dissolved in the solvent can be applied toa substrate as intact as a coating liquid. The applied film can bepolymerized to thereby easily form a dielectric film comprising a highlycrosslinked polybenzazole.

Dielectric Film

The dielectric film of the present invention is formed by applying thematerial composition of the present invention to a substrate. Morespecifically, the dielectric film is formed, for example, by applyingthe polymerizable material composition to a substrate and polymerizingthe applied film by heating. Examples of the substrate are siliconwafers, metal substrates, and ceramic substrates. The materialcomposition can be applied according to a conventional procedure notspecifically limited, such as spin coating, dip coating or spraycoating.

The heating can be performed at any temperature, as long as thepolymerizable components can be polymerized, and is performed at atemperature, for example, from about 100° C. to about 500° C., andpreferably from about 150° C. to about 450° C. at a constant temperatureor with a stepwise temperature gradient. The heating can be performed inany atmosphere such as air atmosphere, as long as the properties of theresulting thin film are not adversely affected, but preferably in anatmosphere of inert gas such as nitrogen or argon gas, or in vacuo.

As a result of heating, the polycondensation reaction between theadamantanepolycarboxylic acid and the aromatic polyamine in the materialcomposition proceeds to form a polybenzazole (an imidazole, an oxazoleor a thiazole) having an adamantane skeleton as a polymer (highmolecular weight crosslinked product) of the present invention.

The dielectric film of the present invention preferably has a 5% weightloss temperature of 500° C. or higher. After investigations on theformation of dielectric films, the present inventors have found that, ifa ketone or aldehyde is used as a solvent, the solvent reacts with themonomer component aromatic polyamine to form a Schiff base to therebyadversely affect the cyclization between the aromatic polyamine and theadamantanepolycarboxylic acid, and the resulting polymer does not have auniform structure due to the presence of, for example, free carboxylgroups and amido groups in the molecule. The present invention has beenaccomplished based on these findings. According to the presentinvention, a solvent other than ketones and aldehydes is used to therebyavoid the above problems, and a complete ring can be formed by thepolycondensation reaction between, for example, an amino group of thearomatic polyamine and a carboxyl group of the adamantanepolycarboxylicacid to thereby yield a highly crosslinked polybenzazole as apolymerized product. Thus, the dielectric film of the present inventionhas a 5% weight loss temperature of generally 500° C. or higher and canexhibit high heat resistance. The 5% weight loss temperature iscontrolled by the degree of crosslinking of the polymer constituting thedielectric film, can be adjusted by appropriately selecting the monomercomponents and is preferably 530° C. or higher, and more preferably 550°C. or higher. If the 5% weight loss temperature is lower than 500° C.,the dielectric film may have insufficient heat resistance and is notsuitable as an electronic material part in semiconductor devices.

The relative dielectric constant of the dielectric film is preferablylower from the view point of insulating properties, and is, for example,2.8 or less, preferably 2.6 or less, and typically preferably 2.3 orless. The dielectric film of the present invention is a polymer havingan adamantane ring, aromatic ring, and azole ring or 6-memberednitrogen-containing ring (a ring formed in a polycondensed moiety) asmain constitutional units. For example, by using anadamantanepolycarboxylic acid having three functional groups, a highlycrosslinked polymer film can be formed, in which the adamantane compoundhaving a three-dimensional structure and the aromatic polyamine having atwo-dimensional structure are combined to form a structure havingcrosslinks in three directions with the adamantane skeleton as vertexes(crosslinking points). That is, the film has a unit in which threehexagons commonly possess two vertexes or two sides. By using anadamantanepolycarboxylic acid having four functional groups, a netpolymer film can be formed, in which crosslinks are formed in fourdirections with the adamantane skeleton as vertexes (crosslinkingpoints). That is, the film has a unit in which three hexagons commonlypossess two sides. Thus, the dielectric film of the present inventioninvolves a multitude of uniformly dispersed molecular-scale voids andcan have a satisfactorily low relative dielectric constant.

The dielectric films of the present invention can be used, for example,as dielectric coatings in electronic material parts such assemiconductor devices and are particularly useful as interlayerdielectrics.

The present invention will be illustrated in further detail withreference to several examples and comparative examples below, which arenot intended to limit the scope of the invention. The symbols “s”, “m”and “w” in infrared absorption spectral data indicate absorptionintensity of a wavelength indicated prior to each symbol and mean thatthe absorption is “strong”, “medium” or “weak”, respectively.

Evaluation Test

The properties of polybenzazole polymer films prepared in the examplesand comparative examples were determined by the following methods.

5% Weight Loss Temperature

A sample polybenzazole polymer film was subjected to thermogravimetricanalysis at a rise rate of 10° C./min in a nitrogen atmosphere using athermogravimetry-differential thermal analyzer (TG-DTA) that can measuresamples up to a maximum temperature of 550° C., and the temperature atwhich 5% of the total weight of the sample was reduced (5% weight losstemperature) was determined.

Relative Dielectric Constant

Aluminum (Al) electrodes were formed on the surface of a samplepolybenzazole polymer film, and the relative dielectric constant wasdetermined.

EXAMPLE 1

In a solvent N-methylpyrrolidone (NMP) were dissolved 5.37 g (20 mmol)of 1,3,5-adamantanetricarboxylic acid and 6.43 g (30 mmol) of3,3′-diaminobenzidine at room temperature in a nitrogen atmosphere andthereby yielded a coating liquid. After filtrating through a filter witha pore size of 0.1 μm, the coating liquid was applied to an 8-inchsilicon wafer by spin coating. In a nitrogen atmosphere, this was heatedat 300° C. for 30 minutes and was then heated at 400° C. for further 30minutes, to form a film. The infrared absorption spectrum of theresulting polymer film was determined. The result is shown in FIG. 1,verifying that a target crosslinked polybenzimidazole film was formed.The film had a 5% weight loss temperature of 536° C. and a relativedielectric constant of 2.6.

Infrared absorption spectral data (cm⁻¹):

805 (m), 1280 (m), 1403 (m), 1450 (s), 1522 (w), 1625 (w) 2857 (w), 2928(w), 3419 (w)

EXAMPLE 2

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 1, except that a 2:1 (by weight) mixture of N-methylpyrrolidone(NMP) and tetrahydrofuran (THF) was used as the solvent instead ofN-methylpyrrolidone alone. The film had a 5% weight loss temperature of536° C. and a relative dielectric constant of 2.6.

EXAMPLE 3

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 1, except that a 2:1 (by weight) mixture of dimethylacetamide(DMAC) and tetrahydrofuran (THF) was used as the solvent instead ofN-methylpyrrolidone alone. The film had a 5% weight loss temperature of536° C. and a relative dielectric constant of 2.6.

EXAMPLE 4

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 1, except that 1,2,4,5-tetraaminobenzene was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 530°C. and a relative dielectric constant of 2.7.

EXAMPLE 5

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 1, except that 2,3,6,7-tetraaminonaphthalene was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 542°C. and a relative dielectric constant of 2.6.

EXAMPLE 6

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 1, except that 4,5,9,10-tetraaminopyrene was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 550°C. or higher and a relative dielectric constant of 2.6.

EXAMPLE 7

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 1, except that 2,3,6,7-tetraaminoanthracene was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 550°C. or higher and a relative dielectric constant of 2.6.

EXAMPLE 8

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 1, except that 1,3-diamino-4,6-bis(phenylamino)benzene was usedinstead of 3,3′-diaminobenzidine. The film had a 5% weight losstemperature of 550° C. or higher and a relative dielectric constant of2.6.

EXAMPLE 9

A crosslinked polybenzoxazole film was prepared by the procedure ofExample 1, except that 3,3′-dihydroxybenzidine was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 535°C. and a relative dielectric constant of 2.5.

EXAMPLE 10

A crosslinked polybenzothiazole film was prepared by the procedure ofExample 1, except that 3,3′-dimercaptobenzidine was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 540°C. and a relative dielectric constant of 2.5.

EXAMPLE 11

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 1, except that 1,3,5-tris(4-carboxyphenyl)adamantane and1,2,4,5-tetraaminobenzene were used instead of1,3,5-adamantanetricarboxylic acid and 3,3′-diaminobenzidine,respectively. The film had a 5% weight loss temperature of 550° C. orhigher and a relative dielectric constant of 2.5.

EXAMPLE 12

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 1, except that 1,3,5-tris(4-carboxyphenyl)adamantane was usedinstead of 1,3,5-adamantanetricarboxylic acid. The film had a 5% weightloss temperature of 550° C. or higher and a relative dielectric constantof 2.4.

COMPARATIVE EXAMPLE 1

A polymer film was prepared by the procedure of Example 1, except thatcyclohexanone (CHN) was used as the solvent instead ofN-methylpyrrolidone. The infrared absorption spectrum of the polymerfilm was determined, and the result is shown in FIG. 2. FIG. 2 showsthat the polymer had strong absorption at around 2900 cm⁻¹ (2857 cm⁻¹and 2928 cm⁻¹), indicating that a Schiff base formed as a result of thereaction between the solvent cyclohexanone and the monomer aromaticpolyamine remains and inhibits the formation of imidazole rings. Thefilm had a 5% weight loss temperature of 426° C. and a relativedielectric constant of 2.9.

Infrared absorption spectral data (cm⁻¹):

805 (m), 1280 (m), 1403 (m), 1450 (s), 1522 (w), 1625 (w) 2857 (s), 2928(s), 3419 (w)

COMPARATIVE EXAMPLE 2

A polymer film was prepared by the procedure of Example 1, except thatcyclopentanone (CPN) was used as the solvent instead ofN-methylpyrrolidone. The infrared absorption spectrum of the polymerfilm was determined. The polymer had strong absorption at around 2900cm⁻¹ (2857 cm⁻¹ and 2928 cm⁻¹), indicating that a Schiff base formed asa result of the reaction between the solvent cyclopentanone and themonomer aromatic polyamine remains and inhibits the formation ofimidazole rings. The film had a 5% weight loss temperature of 420° C.and a relative dielectric constant of 3.0.

Infrared absorption spectral data (cm⁻¹):

805 (m), 1280 (m), 1403 (m), 1450 (s), 1522 (w), 1625 (w) 2857 (s), 2928(s), 3419 (w)

COMPARATIVE EXAMPLE 3

A polymer film was prepared by the procedure of Example 1, except that a2:1 (by weight) mixture of N-methylpyrrolidone (NMP) and acetone wasused as the solvent instead of N-methylpyrrolidone alone. The infraredabsorption spectrum of the polymer film was determined. The polymer hadmedium absorption at around 2900 cm⁻¹ (2857 cm⁻¹ and 2928 cm⁻¹),indicating that a Schiff base formed as a result of the reaction betweenthe solvent acetone and the monomer aromatic polyamine remains andinhibits the formation of imidazole rings. The film had a 5% weight losstemperature of 465° C. and a relative dielectric constant of 2.9.

Infrared absorption spectral data (cm⁻¹):

805 (m), 1280 (m), 1403 (m), 1450 (s), 1522 (w), 1625 (w), 2857 (m),2928 (m), 3419 (w)

EXAMPLE 13

In a solvent N-methylpyrrolidone (NMP) were dissolved 5.37 g (20 mmol)of 1,3,5,7-adamantanetetracarboxylic acid and 8.57 g (40 mmol) of3,3′-diaminobenzidine at room temperature in a nitrogen atmosphere andthereby yielded a coating liquid. After filtrating through a filter witha pore size of 0.1 μm, the coating liquid was applied to an 8-inchsilicon wafer by spin coating. In a nitrogen atmosphere, this was heatedat 300° C. for 30 minutes and was then heated at 400° C. for further 30minutes, to form a film. The infrared absorption spectrum of theresulting polymer film was determined, verifying that the targetcrosslinked polybenzimidazole film was formed. The film had a 5% weightloss temperature of 550° C. or higher and a relative dielectric constantof 2.3.

Infrared absorption spectral data (cm⁻¹):

805 (m), 1280 (m), 1403 (m), 1450 (s), 1522 (w), 1625 (w) 2857 (w), 2928(w), 3419 (w)

EXAMPLE 14

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 13, except that a 2:1 (by weight) mixture of N-methylpyrrolidone(NMP) and tetrahydrofuran (THF) was used as the solvent instead ofN-methylpyrrolidone alone. The film had a 5% weight loss temperature of550° C. or higher and a relative dielectric constant of 2.3.

EXAMPLE 15

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 13, except that a 2:1 (by weight) mixture of dimethylacetamide(DMAC) and tetrahydrofuran (THF) was used as the solvent instead ofN-methylpyrrolidone alone. The film had a 5% weight loss temperature of550° C. or higher and a relative dielectric constant of 2.3.

EXAMPLE 16

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 13, except that 1,2,4,5-tetraaminobenzene was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 550°C. or higher and a relative dielectric constant of 2.4.

EXAMPLE 17

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 13, except that 2,3,6,7-tetraaminonaphthalene was used insteadof 3,3′-diaminobenzidine. The film had a 5% weight loss temperature of550° C. or higher and a relative dielectric constant of 2.3.

EXAMPLE 18

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 13, except that 4,5,9,10-tetraaminopyrene was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 550°C. or higher and a relative dielectric constant of 2.3.

EXAMPLE 19

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 13, except that 2,3,6,7-tetraaminoanthracene was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 550°C. or higher and a relative dielectric constant of 2.3.

EXAMPLE 20

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 13, except that 1,3-diamino-4,6-bis(phenylamino)benzene was usedinstead of 3,3′-diaminobenzidine. The film had a 5% weight losstemperature of 550° C. or higher and a relative dielectric constant of2.3.

EXAMPLE 21

A crosslinked polybenzoxazole film was prepared by the procedure ofExample 13, except that 3,3′-dihydroxybenzidine was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 550°C. or higher and a relative dielectric constant of 2.2.

EXAMPLE 22

A crosslinked polybenzothiazole film was prepared by the procedure ofExample 13, except that 3,3′-dimercaptobenzidine was used instead of3,3′-diaminobenzidine. The film had a 5% weight loss temperature of 550°C. or higher and a relative dielectric constant of 2.2.

EXAMPLE 23

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 13, except that 1,3,5,7-tetrakis(4-carboxyphenyl)adamantane and1,2,4,5-tetraaminobenzene were used instead of1,3,5,7-adamantanetetracarboxylic acid and 3,3′-diaminobenzidine,respectively. The film had a 5% weight loss temperature of 550° C. orhigher and a relative dielectric constant of 2.2.

EXAMPLE 24

A crosslinked polybenzimidazole film was prepared by the procedure ofExample 13, except that 1,3,5,7-tetrakis(4-carboxyphenyl) adamantane wasused instead of 1,3,5,7-adamantanetetracarboxylic acid. The film had a5% weight loss temperature of 550° C. or higher and a relativedielectric constant of 2.1.

COMPARATIVE EXAMPLE 4

A polymer film was prepared by the procedure of Example 13, except thata 2:1 (by weight) mixture of N-methylpyrrolidone (NMP) and cyclohexanone(CHN) was used as the solvent instead of N-methylpyrrolidone alone. Theinfrared absorption spectrum of the polymer film was determined. Thepolymer had strong absorption at around 2900 cm⁻¹ (2857 cm⁻¹ and 2928cm⁻¹; cyclohexane ring of a Schiff base), indicating that a Schiff baseformed as a result of the reaction between the solvent cyclohexanone andthe monomer aromatic polyamine remains and inhibits the formation ofimidazole rings. The film had a 5% weight loss temperature of 455° C.and a relative dielectric constant of 2.6.

Infrared absorption spectral data (cm⁻¹):

805 (m), 1280 (m), 1403 (m), 1450 (s), 1522 (w), 1625 (w) 2857 (s), 2928(s), 3419 (w)

COMPARATIVE EXAMPLE 5

A polymer film was prepared by the procedure of Example 13, except thata 2:1 (by weight) mixture of N-methylpyrrolidone (NMP) andcyclopentanone (CPN) was used as the solvent instead ofN-methylpyrrolidone alone. The infrared absorption spectrum of thepolymer film was determined. The polymer had strong absorption at around2900 cm⁻¹ (2857 cm⁻¹ and 2928 cm⁻¹; cyclopentane ring of a Schiff base),indicating that a Schiff base formed as a result of the reaction betweenthe solvent cyclopentanone and the monomer aromatic polyamine remainsand inhibits the formation of imidazole rings. The film had a 5% weightloss temperature of 450° C. and a relative dielectric constant of 2.7.

Infrared absorption spectral data (cm⁻¹):

805 (m), 1280 (m), 1403 (m), 1450 (s), 1522 (w), 1625 (w), 2857 (s),2928 (s), 3419 (w)

COMPARATIVE EXAMPLE 6

A polymer film was prepared by the procedure of Example 13, except thata 2:1 (by weight) mixture of N-methylpyrrolidone (NMP) and acetone wasused as the solvent instead of N-methylpyrrolidone alone. The infraredabsorption spectrum of the polymer film was determined. The polymer hadstrong absorption at around 2900 cm⁻¹ (2857 cm⁻¹ and 2928 cm⁻¹;methylidene group of a Schiff base), indicating that a Schiff baseformed as a result of the reaction between the solvent acetone and themonomer aromatic polyamine remains and inhibits the formation ofimidazole rings. The film had a 5% weight loss temperature of 495° C.and a relative dielectric constant of 2.6.

Infrared absorption spectral data (cm⁻¹):

805 (m), 1280 (m), 1403 (m), 1450 (s), 1522 (w), 1625 (w), 2857 (m),2928 (m), 3419 (w)

COMPARATIVE EXAMPLE 7

In a flask equipped with a stirrer and a condenser were placed 5.37 g(20 mmol) of 1,3,5-adamantanetricarboxylic acid, 6.43 g (30 mmol) of3,3′-diaminobenzidine and 100 g of a polyphosphoric acid, followed byheating and stirring at 200° C. in a nitrogen atmosphere for 12 hours.After cooling, the reaction mixture was mixed with water, theprecipitated solid was collected by filtration and was washed withaqueous sodium hydrogen carbonate solution, water, and methanol, toyield a polybenzimidazole as a solid. An attempt was made to dissolvethe solid polybenzimidazole in a solvent, N-methylpyrrolidone (NMP), butwas failed. Thus, a thin film could not be formed by spin coating, and atarget thin film was not prepared.

While the present invention has been described with reference to whatare presently considered to be the preferred embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments. On the contrary, the invention is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims. The scope of the following claims is to beaccorded the broadest interpretation so as to encompass all suchmodifications and equivalent structures and functions.

1. A material for dielectric films, which is a polymerizable compositioncomprising: an adamantanepolycarboxylic acid represented by followingFormula (1):

wherein X is a carboxyl group; and Y¹, Y², Y³ and Y⁴ may be the same asor different from one another and are each a single bond or a bivalentaromatic cyclic group; an aromatic polyamine represented by followingFormula (2):

wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R¹ andR² are each a substituent bound to Ring Z, may be the same as ordifferent from each other and are each an amino group, amono-substituted amino group, a hydroxyl group or a mercapto group; anda solvent other than ketones and aldehydes, wherein theadamantanepolycarboxylic acid and the aromatic polyamine are dissolvedin the solvent.
 2. A material for dielectric films according to claim 1,wherein Ring Z is a polycyclic aromatic hydrocarbon ring or an aromaticheterocyclic ring.
 3. A material for dielectric films according to claim1, wherein at least one of R¹ and R²is a mono-substituted amino group.4. A polymer which is a polymerized product of a polymerizablecomposition comprising: an adamantanepolycarboxylic acid represented byfollowing Formula (1):

wherein X is a carboxyl group; and Y¹, Y², Y³ and Y⁴ may be the same asor different from one another and are each a single bond or a bivalentaromatic cyclic group; an aromatic polyamine represented by followingFormula (2):

wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R¹ andR² are each a substituent bound to Ring Z, may be the same as ordifferent from each other and are each an amino group, amono-substituted amino group, a hydroxyl group or a mercapto group; anda solvent other than ketones and aldehydes, wherein theadamantanepolycarboxylic acid and the aromatic polyamine are dissolvedin the solvent.
 5. A polymer according to claim 4, wherein Ring Z is apolycyclic aromatic hydrocarbon ring or an aromatic heterocyclic ring.6. A polymer according to claim 4, wherein at least one of R¹ and R² isa mono-substituted amino group.
 7. A dielectric film comprising apolymer according to claim
 4. 8. A dielectric film comprising a polymeraccording to claim
 5. 9. A dielectric film comprising a polymeraccording to claim
 6. 10. A dielectric film comprising a polymer formedfrom: an adamantanepolycarboxylic acid represented by following Formula(1):

wherein X is a carboxyl group; Y¹, Y², Y³ and Y⁴ may be the same as ordifferent from one another and are each a single bond or a bivalentaromatic cyclic group; and an aromatic polyamine represented byfollowing Formula (2):

wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R¹ andR² are each a substituent bound to Ring Z, may be the same as ordifferent from each other and are each an amino group, amono-substituted amino group, a hydroxyl group or a mercapto group,wherein the dielectric film has a 5% weight loss temperature of 500° C.or higher.
 11. A dielectric film according to claim 10, wherein Ring Zis a polycyclic aromatic hydrocarbon ring or an aromatic heterocyclicring.
 12. A dielectric film according to claim 10, wherein at least oneor R¹ and R² is a mono-substituted amino group.